These pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronics packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers an extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. Both are supplied frozen in bulk or standard syringe sizes.
The new dispense system for CHO-BOND 584-29 adhesive features a pair of syringes, one containing a hardener and one with the conductive resin, separated by a connector.
Is especially well suited for temperature-sensitive, high performance applications. Request Technical Bulletin.
Die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleed out on a variety of substrates and metallizations. Request Technical Bulletin.