CHO BOND 500 Series

These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the materials are formulated for easy application by caulking gun, spatula, needle spotting, or silk screening. Their use for bonding mesh gaskets, printed circuit board repair, chip bonding, rear window defogger repair, and as low  temperature activated flexible solders demonstrates their versatility. Request Technical Bulletin 10.


Adhesive bonds dissimilar materials effectively. It combines long pot-life and excellent adhesion with low viscosity, a low coefficient of thermal expansion, very low thermal impedance and good thermal shock resistance. The material excels as a sealant for microwave modules and components and is useful for circuit board repair and grounding applications.

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CHO-BOND 584-208

Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212°F (100°C), the material offers volume resistivity of 0.005 ohm-cm.

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CHO-BOND 584-29

Combines room temperature cure with low viscosity, and can be used in place of soldering or welding. It is available in easy-to-use, two-chambered CHO-PAK dispensers in 1.0, 2.5 and 10 gram sizes (see photo above). These systems eliminate waste, mistakes, and time lost weighing components. Bulk kits are also available.

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