CHO-BOND 1029
Is a two-compo- nent adhesive cured under pressure (6 psi/0.04 MPa, min.). Bond line thickness should not exceed 8 mils. Conductivity decreases sharply at >20 mil thickness. The material possesses superior lap shear (450 psi/3.10 MPa, min.). Ideal for quick bonding of conductive elastomers, the material’s cure can be accelerated to 30 minutes at 250°F (121°C). Request Technical Bulletin 32. Visit Marketing East if you are interested in purchasing Cho Bond 1029
Cho Bond 1029 Data Sheet (PDF)
| Binder | SILICONE |
| Filler | Ag/Cu |
| Mix Ratio (by wgt.) | 1.0:2.5 |
| Consistency | thick paste |
| Specific Gravity | 3.0 ±0.35 |
| Minimum Lap Shear Strength, psi (MPa) |
450 (3.11) |
| Minimum Die Shear* Strength, psi (MPa) |
|
| Maximum DC Volume Resistivity, ohm-cm |
0.06* |
| Use Temperature | –67 to 257°F (–55 to 125°C) |
| Elevated Temperature Cure Cycle |
0.5 hr. @ 250°F (121°C) |
| Room Temperature Cure |
1 wk.*** |
| Working Life | 2.0 hrs. |
| Shelf Life, mos. | 6 |
| Coverage, in.2/lb. (cm2/g) |
1,800 ) 5 . 5 2 ( |
| Recommended Thickness, in. (mm) |
0.008 max. (0.20) |
| VOC, g/liter | 0 |
| * Alumina die on gold ** at -40°F (-40°C) NA Not Applicable |