CHO-BOND 1029
Is a two-compo- nent adhesive cured under pressure (6 psi/0.04 MPa, min.). Bond line thickness should not exceed 8 mils. Conductivity decreases sharply at >20 mil thickness. The material possesses superior lap shear (450 psi/3.10 MPa, min.). Ideal for quick bonding of conductive elastomers, the material’s cure can be accelerated to 30 minutes at 250°F (121°C). Request Technical Bulletin 32. Visit Marketing East if you are interested in purchasing Cho Bond 1029
Cho Bond 1029 Data Sheet (PDF)
Binder | SILICONE |
Filler | Ag/Cu |
Mix Ratio (by wgt.) | 1.0:2.5 |
Consistency | thick paste |
Specific Gravity | 3.0 ±0.35 |
Minimum Lap Shear Strength, psi (MPa) |
450 (3.11) |
Minimum Die Shear* Strength, psi (MPa) |
|
Maximum DC Volume Resistivity, ohm-cm |
0.06* |
Use Temperature | –67 to 257°F (–55 to 125°C) |
Elevated Temperature Cure Cycle |
0.5 hr. @ 250°F (121°C) |
Room Temperature Cure |
1 wk.*** |
Working Life | 2.0 hrs. |
Shelf Life, mos. | 6 |
Coverage, in.2/lb. (cm2/g) |
1,800 ) 5 . 5 2 ( |
Recommended Thickness, in. (mm) |
0.008 max. (0.20) |
VOC, g/liter | 0 |
* Alumina die on gold ** at -40°F (-40°C) NA Not Applicable |