CHO-BOND SV713

CHO-BOND SV713

Is especially well suited for temperature-sensitive, high performance applications. Request Technical Bulletin.

Binder EPOXY
Filler Ag
Mix Ratio (by wgt.) 1-part
Consistency thixotropic paste
Specific Gravity 2.5 ±0.30
Minimum Lap Shear
Strength, psi (MPa)
1000 (6.90)
Minimum Die Shear*
Strength, psi (MPa)
4500 (31.05)
Maximum DC
Volume Resistivity,
ohm-cm
0.0007
Use Temperature –49 to 302°F (–45 to 150°C)
Elevated
Temperature
Cure Cycle
1hr. @257°F(125°C) or 30 min.@ 302°F (150°C)
Room Temperature
Cure
NA
Working Life 3 wks.
Shelf Life, mos. 12**
Coverage, in.2/lb.
(cm2/g)
NA
Recommended
Thickness, in. (mm)
0.001 min. (0.025)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND SV713 50-01-SV713-0000 1 pound kit (0.5 kg)* RFQ Only Yes
CHO-BOND SV713 50-00-SV713-0000 250 gram kit kit (0.55 lb.)* RFQ Only Yes

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