CHO-BOND SV712

CHO-BOND SV712

Die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleedout on a variety of substrates and metallizations. Cho Bond SV 712 PDF Data Sheet.

Binder EPOXY
Filler Ag
Mix Ratio (by wgt.) 1-part
Consistency thixotropic paste
Specific Gravity 3.3 ±0.30
Minimum Lap Shear
Strength, psi (MPa)
1100 (7.59)
Minimum Die Shear*
Strength, psi (MPa)
4800 (33.12)
Maximum DC
Volume Resistivity,
ohm-cm
0.0004
Use Temperature –49 to 302°F (–45 to 150°C)
Elevated
Temperature
Cure Cycle
1hr. @257°F(125°C) 1hr. @257°F(125°C) or 30 min.@ 302°F (150°C)
Room Temperature
Cure
NA
Working Life 4 wks.
Shelf Life, mos. 12**
Coverage, in.2/lb.
(cm2/g)
NA
Recommended
Thickness, in. (mm)
0.001 typ. (0.025)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND SV712 50-38-SV712-0000 10 cc syringe* RFQ Only Yes
CHO-BOND SV712 50-17-SV712-0000 5 cc syringe* RFQ Only Yes
CHO-BOND SV712 50-04-SV712-0000 1 cc syringe* RFQ Only Yes
CHO-BOND SV712 50-01-SV712-0000 1 pound kit (0.5 kg)* RFQ Only Yes
CHO-BOND SV712 50-00-SV712-0000 250 gram kit kit (0.55 lb.)* RFQ Only Yes

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