CHO-BOND 592

CHO-BOND 592

Adhesive bonds dissimilar materials effectively. It combines long pot-life and excellent adhesion with low viscosity, a low coefficient of thermal expansion, very low thermal impedance and good thermal shock resistance. The mater- ial excels as a sealant for microwave modules and components and is useful for circuit board repair and grounding applications. If you are looking for Cho Bond 1030 visit Marketing East 

Binder EPOXY
Filler Ag
Mix Ratio (by wgt.) 100:50
Consistency nearly liquid
Specific Gravity 2.6 ±0.25
Minimum Lap Shear
Strength, psi (MPa)
1500 (10.35)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.05
Use Temperature –80 to 210°F (–62 to 99°C)
Elevated
Temperature
Cure Cycle
30 min. @ 212°F (100°C)
Room Temperature
Cure
1 wk.
Working Life 4.0 hrs.
Shelf Life, mos. 9
Coverage, in.2/lb.
(cm2/g)
12,000 (170.3)
Recommended
Thickness, in. (mm)
0.001 min. (0.025)
VOC, g/liter 47 (A & B)
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 592 50-00-0592-0000 3 ounce kit (85 g) RFQ Only Yes
CHO-BOND 592 50-01-0592-0000 1 pound kit (0.5 kg) RFQ Only Yes

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