CHO-BOND 584-29

CHO-BOND 584-29

 CHO – Bond 584-29 combines room temperature cure with low viscosity, and can be used in place of soldering or welding. Cho-Bond 584-29  is available in easy-to-use, two-chambered CHO-PAK dispensers in 1.0, 2.5 and 10 gram sizes (see photo above). These systems eliminate waste, mistakes, and time lost weighing components. Bulk kits of Cho-Bond 584-29 are also available.

CHO_BOND 584-29 PDF Data Sheet

 

Binder EPOXY
Filler Ag
Mix Ratio (by wgt.) 100:6.3
Consistency thin paste
Specific Gravity 2.5 ±0.20
Minimum Lap Shear
Strength, psi (MPa)
1200 (8.28)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.002
Use Temperature –67 to 257°F (–55 to 125°C)
Elevated
Temperature
Cure Cycle
15 min. @ 235°F (113°C)
Room Temperature
Cure
24 hrs.
Working Life 0.5 hr.
Shelf Life, mos. 9
Coverage, in.2/lb.
(cm2/g)
11,000 (156.1)
Recommended
Thickness, in. (mm)
0.001 min. (0.025)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 584-29 50-00-0584-0029 3 ounce kit (85 g) RFQ Only Yes
CHO-BOND 584-29 50-01-0584-0029 1 pound kit (0.5 kg) RFQ Only Yes
CHO-BOND 584-29 50-03-0584-0029 10 gram CHO-PAK (0.4 oz.) RFQ Only Yes
CHO-BOND 584-29 50-02-0584-0029 2.5 gram CHO-PAK (0.1 oz.) RFQ Only Yes
CHO-BOND 584-29 50-10-0584-0029 1 gram CHO-PAK (0.04 oz.) RFQ Only Yes

Comments are closed.