CHO-BOND 584-208

CHO-BOND 584-208

Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212°F (100°C), the material offers volume resistivity of 0.005 ohm-cm.

Binder EPOXY
Filler Ag
Mix Ratio (by wgt.) 1:1
Consistency medium paste
Specific Gravity 2.7 ±0.30
Minimum Lap Shear
Strength, psi (MPa)
700 (4.83)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.005
Use Temperature –80 to 210°F (–62 to 99°C)
Elevated
Temperature
Cure Cycle
45 min. @ 212°F (100°C)
Room Temperature
Cure
24 hrs.
Working Life 1.0 hr.
Shelf Life, mos. 9
Coverage, in.2/lb.
(cm2/g)
10,000 (141.9)
Recommended
Thickness, in. (mm)
0.001 min. (0.025)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 584-208 50-00-0584-0208 3 ounce kit (85 g) RFQ Only Yes
CHO-BOND 584-208 50-01-0584-0208 1 pound kit (0.5 kg) RFQ Only Yes

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