CHO BOND 500 Series

These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the materials are formulated for easy application by caulking gun, spatula, needle spot- ting, or silk screening. Their use for bonding mesh gaskets, printed cir- cuit board repair, chip bonding, rear window defogger repair, and as low- temperature-activated flexible sol- ders demonstrates their versatility. Request Technical Bulletin 10.

CHO-BOND 592

Adhesive bonds dissimilar materials effectively. It combines long pot-life and excellent adhesion with low viscosity, a low coefficient of thermal expansion, very low thermal impedance and good thermal shock resistance. The mater- ial excels as a sealant for microwave modules and components and is useful for circuit board repair and grounding applications.

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CHO-BOND 584-208

Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212°F (100°C), the material offers volume resistivity of 0.005 ohm-cm.

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CHO-BOND 584-29

Combines room temperature cure with low viscosity, and can be used in place of soldering or welding. It is available in easy-to-use, two-chambered CHO-PAK dispensers in 1.0, 2.5 and 10 gram sizes (see photo above). These systems eliminate waste, mistakes, and time lost weighing components. Bulk kits are also available.

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