CHO-BOND 360-208

CHO-BOND 360-208

Adhesive/sealant uses a filler blend of pure silver and silver-plated-copper particles to produce superior shielding performance without requiring contact pressure, making it an ideal fillet seal. Its low flow properties make it the material of choice for vertical and overhead fillets.

Cho Bond 360-208 data Sheet (PDF)

Binder EPOXY
Filler Ag, Ag/Cu
Mix Ratio (by wgt.) 100:33
Consistency thick paste
Specific Gravity 4.0 ±0.40
Minimum Lap Shear
Strength, psi (MPa)
1400 (9.66)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.01
Use Temperature –80 to 212°F (–62 to 100°C)
Elevated
Temperature
Cure Cycle
45 min. @ 212°F (100°C)
Room Temperature
Cure
24 hrs.
Working Life 1.0 hr.
Shelf Life, mos. 9
Coverage, in.2/lb.
(cm2/g)
700 (9.9)
Recommended
Thickness, in. (mm)
0.010 min. (0.25)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 360-208 50-00-0360-0208 3 ounce kit (85 g) RFQ Only Yes
CHO-BOND 360-208 50-01-0360-0208 1 pound kit (0.5 kg) RFQ Only Yes

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