CHO-BOND 360-20

CHO-BOND 360-20

Is a low-cost, easy-to-mix adhesive/sealant with high lap shear bond strength. It fills large gaps and offers good thermal shock resistance.

Binder EPOXY
Filler Ag/Cu
Mix Ratio (by wgt.) 1:1
Consistency medium paste
Specific Gravity 5.0 ±0.30
Minimum Lap Shear
Strength, psi (MPa)
1600 (11.04)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.005
Use Temperature –80 to 212°F (–62 to 100°C)
Elevated
Temperature
Cure Cycle
2hr. @150°F(66°C)
Room Temperature
Cure
24 hrs.
Working Life 1.0 hr.
Shelf Life, mos. 9
Coverage, in.2/lb.
(cm2/g)
500 (7.1)
Recommended
Thickness, in. (mm)
0.010 min. (0.25)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 360-20 50-01-0360-0020 1 pound kit (0.5 kg) RFQ Only Yes

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