CHO-BOND 1030

CHO-BOND 1030

Is a one-component RTV silicone that cures by exposure to moderate humidity. It has twice the peel strength of other RTVs and a lap shear of 200 psi (1.38 MPa). For maximum conductivity, bond line thickness should not exceed 10 mils. Width should not exceed 0.5 in (1.27 cm) for proper curing. The material cures under nominal pressure of 1-2 psi (0.01 MPa) at temperatures not exceeding 150°F (66°C). Request Technical Bulletin 36. If you want to purchase Cho Bond 1030 or Cho Bond 1038 visit the Marketing East website.

Binder SILICONE
Filler Ag/Cu
Mix Ratio (by wgt.) 1-part
Consistency gritty paste
Specific Gravity 3.75 ±0.25
Minimum Lap Shear
Strength, psi (MPa)
200 (1.38)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.05
Use Temperature –67 to 392°F (–55 to 200°C)
Elevated
Temperature
Cure Cycle
NA
Room Temperature
Cure
1 wk.***
Working Life 0.5 hr.
Shelf Life, mos. 6
Coverage, in.2/lb.
(cm2/g)
13,000 (18.5)
Recommended
Thickness, in. (mm)
0.010 max. (0.25)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 1030 50-02-1030-0000 4 ounce tube (113 g) RFQ Only Yes
CHO-BOND 1030 50-01-1030-0000 1 pound cartridge (0.5 kg) RFQ Only Yes

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