CHO-BOND 1029

CHO-BOND 1029

Is a two-compo- nent adhesive cured under pressure (6 psi/0.04 MPa, min.). Bond line thickness should not exceed 8 mils. Conductivity decreases sharply at >20 mil thickness. The material possesses superior lap shear (450 psi/3.10 MPa, min.). Ideal for quick bonding of conductive elastomers, the material’s cure can be accelerated to 30 minutes at 250°F (121°C). Request Technical Bulletin 32. Visit Marketing East if you are interested in purchasing Cho Bond 1029

Cho Bond 1029 Data Sheet (PDF)

Binder SILICONE
Filler Ag/Cu
Mix Ratio (by wgt.) 1.0:2.5
Consistency thick paste
Specific Gravity 3.0 ±0.35
Minimum Lap Shear
Strength, psi (MPa)
450 (3.11)
Minimum Die Shear*
Strength, psi (MPa)
Maximum DC
Volume Resistivity,
ohm-cm
0.06*
Use Temperature –67 to 257°F (–55 to 125°C)
Elevated
Temperature
Cure Cycle
0.5 hr. @ 250°F (121°C)
Room Temperature
Cure
1 wk.***
Working Life 2.0 hrs.
Shelf Life, mos. 6
Coverage, in.2/lb.
(cm2/g)
1,800 ) 5 . 5 2 (
Recommended
Thickness, in. (mm)
0.008 max. (0.20)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
CHO-BOND 1029 50-00-1029-0000 3 ounce kit (85 g) RFQ Only Yes
CHO-BOND 1029 50-01-1029-0000 1 pound kit (0.5 kg) RFQ Only Yes

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